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CMP Filtration

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Chemical Mechanical Planarization (CMP) is a polishing process used to manufacture wafers for the semiconductor industry. CMP is the state of art technology to remove material from the surface and make it flat/planar by the combined actions of slurry, retaining ringand polishing pad. Particles/gels in the slurry larger than 0.5µm would scratch the surface of the waferhence why slurry particle size is the key aspect of CMP filtration.

Cobetter CMP filters provide a precise retention for large particles and zero retention of useful particles.

 

Recommended Filters

CMPP、 CMPN、CMPA    Multiple Capacity Capsule 

  • High Dirt Holding Capacity Filter Cartridges Feature and Benefits Graded Filtration Multi-layer Nano-fiber media with a graded pore size results in a filter with higher dirt holding capacity and longer service life.
  • Depth Filter for Polishing Slurry Filtration CMPN Filter Cartridges use a unique rolled structure which ensures the precise filtration of CMPN slurry. It captures the large particles efficiently and lets the usable particles pass through. The graded pore size from outside to inside increases the dirt holding capacity and extend the filter service life.
  • Depth Filter for Polishing Slurry Filtration CMPA Filter Cartridges use a unique rolled structure which ensures the precise filtration of CMPA slurry. It captures the large particles efficiently and lets the usable particles pass through. The graded pore size from outside to inside increases the dirt holding capacity and extend the filter service life.
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